Wire Bonding
| Name | Organisation | Location |
|---|---|---|
| Wedge Bonder | School of Electronic & Electrical Eng | Wafer saw and lapping lab |
| Auto Stepback Wedge Bonder | Condensed Matter | Condensed Matter Lab 2 - move once Heliu |
| Wire bonder | School of Electronic & Electrical Eng | Packaging/Dirty Process (Bragg Centre) |