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In this section ESMS Taxonomy

Materials Characterisation
- Optical Microscopy
- Spectroscopy
- Physical Properties
- Chemical Analysis
- Spectrometry
- Imaging
- Surface Analysis
  - Adsorption
- Surface Probe Microscopy
- Mechanical Properties
  - Tensometer
  - Tribometer
  - Vibration
  - Rheometer
  - Load
  - Hardness
  - Dynamic
- Diffraction
  - X-ray (Diffraction)
  - High Energy Electron
- Electron/Ion Microscopy
- Magnetometry
Sample Measurement/Analysis
- Laser (Order)
- Optical (Order)
- Proteins / Nucleic Acids
  - PCR
  - Arrays
  - Sequencers
- Motion
- Bio-Medical
- Electronic
- Cryogenic (Sample Measure Analysis)
  - 1.4K
  - 4K
  - milli-Kelvin
  - He3
  - 77K
- Field Deployable
- Acoustic
Process Equipment - Physical
- Controlled Environment
- Textiles
  - Textile Production
  - Textile Printer
- Chemical Reactor
- Thin Film Deposition
- Etching
- Lithography
- Sample Manipulation
  - Robot
  - Micromanipulation
- Characterisation(Process Equip-Physical)
  - Profilometer
  - Ellipsometry
- Packaging
Process Equipment - Biological
- Characterisation (Process Equip-Biology)
- Growth and Manipulation
- Centrifuge
  - Ultracentrifuges
  - High Speed
- Tissue Processing
- Sterilisation
  - Autoclave
Large Scale Instruments
- Controlled Environments (Lge Sc Instmts)
  - Combustion (Controlled Environments)
- Simulated Environments
Infrastructure
- IT
- Laboratory
- Mechanical (Order)
  - Hydraulic
- Cryogenic (Infrastructure)
  - Liquifier
- Live Performance
  - Instruments
  - Lighting
- Workshop
  - Drill
  - Lathe
  - Other Cutting
  - Milling
  - Sawing
  - CNC Machines
  - Sintering
  - Joining
  - Moulding
  - Grinding
- In Vivo
  - Washing and Watering Systems
- Audio Visual
  - Manipulation
  - Recording
- Vehicles
  - Equipment
  - Agricultural

Home
Taxonomy
Wafer/Chip Bonding

Wafer/Chip Bonding

Name	Organisation	Location
Wafer Bonding System	School of Electronic & Electrical Eng	Deposition (Bragg Centre)
Die Bonder		Deposition (Bragg Centre)

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