Wafer Bonding System
Wafer Bonding System
Details
| Manufacturer | APPLIED MICRO ENGINEERING LTD |
|---|---|
| Model No. | AML-AWB-04 |
| Serial No. | 073 |
| Location | Deposition (Bragg Centre) [1-086-0060-00MB-27] |
| Identifier | 10113515 |
| Organisation: | School of Electronic & Electrical Eng [50000070] |
| Owner |
Edmund Linfield
e.h.linfield@leeds.ac.uk 0113-34-32015 |
| Contact |
Christopher Wood
c.d.wood@leeds.ac.uk 0113-34-38335 |
| Category / Taxonomy | Process Equipment - Physical > Packaging > Wafer/Chip Bonding |