Wedge Bonder
Wedge Bonder
Wedge Bonder
Description
The wedge bonder can make interconnections between a semiconductor device and a bonding chip package using heat, pressure and ultrasonic energy. Aluminium and gold wires are commonly used to assemble semiconductor packages. The Kulicke & Soffa model 4123 Wedge bonder can provide ultrasonic power up to 2.0 W to generate heat up to 150°C within bonding time typically ranging from 10 to 100 ms. Gold wire can range from 12-75 microns in diameter, and aluminium wire can range from 25 – 75 microns in diameter. Bonding area is limited in 95 mm × 95 mm.
Details
| Manufacturer | KULICKE & SOFFA |
|---|---|
| Model No. | 4124 |
| Serial No. | 1005 |
| Location | Cryogenics Office [1-086-0028-00MB-B61] |
| Identifier | 10077960 |
| Organisation: | School of Electronic & Electrical Eng [50000070] |
| Owner |
Edmund Linfield
e.h.linfield@leeds.ac.uk 0113-34-32015 |
| Contact | |
| Category / Taxonomy | Process Equipment - Physical > Packaging > Wire Bonding |